Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has unveiled its latest product, the “TLP3475W,” a photorelay packaged in a small and thin WSON4 package. This innovation is specifically engineered to reduce insertion loss and minimize power attenuation in high-frequency signals. Tailored for applications in semiconductor testers requiring high-speed signaling and employing a substantial number of relays, the TLP3475W is now available for volume shipments.
The TLP3475W is designed with optimized packaging to diminish parasitic capacitance and inductance, resulting in reduced insertion loss and enhanced transmission characteristics for high-frequency signals, reaching up to 20GHz (typical). This performance is approximately 1.5 times better than Toshiba’s existing product, the TLP3475S.
Utilizing a compact WSON4 package with a thickness of only 0.8mm (typical), the TLP3475W stands out as the industry’s smallest photorelay. This design advancement, 40% lower in height than Toshiba’s ultra-small S-VSON4T package, facilitates the integration of more products on the same circuit board. Consequently, this efficiency enhancement will contribute significantly to improved measuring processes.
The applications for the TLP3475W extend to semiconductor testers, including high-speed memory testers and high-speed logic testers, probe cards, and various measuring equipment. Its features include the industry’s smallest WSON4 package measuring 1.45mm×2.0mm (typical) and achieving high-frequency signal transmission capabilities of up to 20GHz (typical) at an insertion loss (S21) of -3dB. Furthermore, the photorelay incorporates a normally open function (1-Form-A).
Toshiba has expressed its commitment to expanding its product line-up to further support semiconductor testers, catering to the increasing demand for higher speeds and enhanced functionality in the industry. This development marks a significant step in the realm of semiconductor technology, promising improved efficiency and performance in high-frequency signal applications.
