At the recent TRUSTECH 2023 event in Paris, Tongxin Micro made a significant entrance, showcasing its advancements in identity recognition, telecommunications, and financial payments. The company presented a range of solutions aligned with international standards in these sectors.
Tongxin Micro’s display highlighted their document chip solutions, emphasizing compliance with ICAO standards for applications like seafarer’s passports and official passports. In telecommunications, the company exhibited a suite of products, including standard SIM cards, SWP-SIM, digital car keys, and eSIM wearable devices. Their payment sector offerings encompassed various technologies, spanning chip applications in payment IC cards, display cards, fingerprint cards, e-CNY hardware wallets, and MCU chips tailored for critical products like POS systems.
During a session at the Innovation Stage, John Zou, EVP of Tongxin Micro, introduced an eSIM solution designed specifically for smart POS systems. Zou underscored the existing challenges faced by POS systems necessitating multiple SIM card switches, affecting operational efficiency. The solution, integrating security chips, aims to streamline this process through online eSIM activation and carrier switches, potentially reducing deployment costs. Notably, several terminal device manufacturers have already adopted this solution.
Tongxin Micro remains steadfast in its pursuit of enhancing digital experiences and has expanded its footprint in automotive electronics and smart chips. With a global presence across multiple regions, the company aims to contribute competitive technological solutions to the digital economy.
