Silicon Creations, a provider of analog and mixed-signal IP, has reached a significant milestone by surpassing 10 million wafers in production in collaboration with TSMC, a leading semiconductor foundry.
This achievement underscores Silicon Creations’ substantial impact on the semiconductor industry, with their IP designs spanning nodes from 180nm to 3nm. With approximately 10 billion chips now containing Silicon Creations IP, their contributions are evident across a wide array of global technologies and applications.
Randy Caplan, Co-founder of Silicon Creations, expressed gratitude for the trust customers have placed in them, stating, “Since 2010, Silicon Creations has supported thousands of tape-outs of TSMC-customer SoCs, showcasing our reliability across diverse global technologies.”
Their IP has been integrated into over 1,500 mass production tape-outs with TSMC, indicating the scale and success of their collaboration, particularly with the evolution of TSMC’s FinFET process nodes.
Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC, praised Silicon Creations’ dedication to innovation and quality, highlighting their pivotal role in advancing the TSMC Open Innovation Platform® (OIP) ecosystem and driving customer design success.
In recognition of their excellence, TSMC honored Silicon Creations with their seventh consecutive OIP Partner of the Year Award for Analog/Mixed-Signal IP in October 2023.
Silicon Creations’ technology spans a broad range of process technologies, from 180nm to 3nm, with ongoing development of 2nm IP.
