California-based optical interconnected solutions provider, Ayar Labs appoints Intel veteran Pooya Tadayon as its Vice President of Packaging and Test. A former Fellow and director of Assembly & Test Pathfinding within Intel’s Assembly and Test Technology Development (ATTD) group, Pooya has 47 patents to his name while over three dozen still pending. He brings over two and a half decades of experience and his most recent focus was on advanced packaging technologies and assembly and test solutions for co-packaged optics that can scale to high volume.
“The demand for photonics technology is rapidly increasing to meet the bandwidth and energy requirements of AI,” said Pooya. “My goal at Ayar Labs is to accelerate assembly and test ecosystem maturation to support the volumes being projected for optical I/O in AI connectivity.”
At Ayar Labs, Pooya will lead the creation of OSAT (outsourced semiconductor assembly and test) process to enable the photonics ecosystem and accelerate the adoption of Ayar Labs’ solutions.
“Pooya brings a strategic advantage to Ayar Labs with his deep expertise in solving complex packaging and testing challenges in large-scale, multi-die systems for high-volume manufacturing,” said Mark Wade, CEO and Co-Founder of Ayar Labs. “His pioneering work positions us to significantly increase production of our optical I/O solutions to millions of units of volume to meet the growing demand for AI scale-up fabrics.”
Ayar Labs constantly partners with leading OSATs to manufacture its optical I/O solutions at scale and integrate it seamlessly into AI systems. The company has also made significant investments in hiring test, validation and equipment engineers. It is also purchasing wafer testers and developing a suite of tests for the optical and electrical interfaces of its chiplets.
Ayar Labs recently added several industry veterans to the company’s board of directors and a new CTO to accelerate its growth. it is also hiring for a number of engineering and manufacturing operation roles.
