Moving ahead with their ongoing strategic partnership on 3D-IC enablement, EDA flows and IP development across multiple Intel process nodes, Intel and Cadence forge strategic collaboration. This begins Intel 18A Cadence announcement of the availability of a complete embedded multi-die interconnected bridge (EMIB) 2.5D advanced packaging flow, enhancements to the Intel 18A digital and custom/analog flows, a wide range of IP portfolio and the corresponding process design kits (PDKs) across various process nodes.
Cadence and Intel have marked significant progress in their ongoing collaboration with several key achievements. The EMIB Reference Flow, tailored for Intel 18A technology, facilitates seamless integration of heterogeneous designs, leveraging advanced packaging capabilities. Meanwhile, the Digital Full-Flow has been certified and optimized to meet stringent power, performance, and area (PPA) targets with features like RibbonFET transistors and PowerVia backside power delivery. The Custom/Analog Flow integrates Cadence’s Virtuoso Studio, enabling efficient design and layout implementation for complex mixed-signal designs on the Intel 18A process. Additionally, Cadence’s Design IP for Intel 18A supports high-performance computing and AI/ML applications, offering capabilities such as PCIe 6.0, CXL, LPDDR5X/5 PHY, UCIe for system integration, and 112G SerDes for superior performance in advanced silicon technologies and 3D-IC packaging solutions.
Tom Beckley, senior VP and general manager, Custom IC & PCB Group at Cadence, commented, “Our close collaboration with Intel Foundry on 3D-IC enablement, EDA flows and IP is yielding significant results for mutual customers developing complex AI-enabling semiconductors and electronic systems. The availability of the complete EMIB 2.5D advanced packaging flow and other key milestones demonstrate the strength of our partnership and our commitment to delivering next-generation system innovations.”
“The challenges of system-level exploration and optimization require co-design and co-optimization from RTL through package, board and system. We rely on Cadence as one of the key ecosystem partners to deliver best-in-class AI-powered EDA solutions and IP technology in pursuit of our goal to be a systems foundry for the AI era,” added Suk Lee, VP & CM, Ecosystem Technology Office, Intel Foundry.
