United Semiconductor Japan Co., Ltd. (USJC) collaborates with DENSO Corporation on the production of power semiconductors at USJC’s 300mm fab to serve the growing demand in the automotive market.
USJC’s wafer fab will now have an insulated gate bipolar transistor (IGBT) line, which will be Japan’s first to produce IGBTs on 300mm wafers. DENSO, a mobility supplier, will offer its system-oriented IGBT device and process technologies while USJC, a subsidiary of global semiconductor foundry United Microelectronics Corporation (NYSE: UMC; TESE: 2303), will provide its 300mm wafer manufacturing capabilities to bring the 300mm IGBT process into mass production. The manufacturing will start in the first half of 2023. The collaboration is supported by the renovation and decarbonization program for indispensable semiconductors of Japan’s Ministry of Economy, Trade and Industry.
Due to the rising adoption of electric cars, the demand for semiconductors required in the electrification of vehicles is also rapidly increasing. IGBTs are core devices in power cards, serving as efficient power switches in inverters to convert DC and AC currents in order to drive and control electric vehicle motors.
“DENSO is very glad to be the member of first companies in Japan to start mass production of IGBTs on 300 mm wafers,” said Koji Arima, President of DENSO. “Semiconductors are becoming increasingly important in the automotive industry as mobility technologies evolve, including automated driving and electrification. Through this collaboration, we contribute to the stable supply of power semiconductors and electrification of automobiles.”
“As a key foundry player in Japan, USJC is committed to supporting the government’s strategy to boost domestic semiconductor production and the transition to more environmentally-friendly electric vehicles,” said Michiari Kawano, President of USJC. “We are confident that our foundry services certified by automotive customers combined with DENSO’s expertise will produce high-quality products to power the automotive trends of tomorrow.”
“We are pleased to have this win-win collaboration with a leading company such as DENSO. This is an important project for UMC and will expand our relevance and influence in the automotive segment,” said Jason Wang, co-president of UMC. “With our robust portfolio of advanced speciality technologies and IATF 16949 certified fabs in diversified locations, UMC is well placed to serve demand across auto applications, including advanced driver assistance systems, infotainment, connectivity, and powertrain. We look forward to capitalizing on more cooperation opportunities going forward with top players in the automotive space.”
