Media Partner For

Alliance Partner For

TRENDING

Siemens Expands TSMC Collaboration with Certified Tools for Next-Gen Chip Innovation

OKI Breaks New Ground with 124-Layer PCB for AI Semiconductor Testing

Apple to Strip Secret Robotics Unit From AI Chief Weeks After Moving Siri

ChEmpower Powers Up with $18.7M for Scratch-Free Chipmaking

George Holmes Named CEO as UBILITE Strengthens Executive Bench

NTT DATA, Neysa Ink MoU with Telangana Govt to Set Up Rs 10,500 Cr AI Data Centre Cluster

Cadence, TSMC Advance AI Chip Design with Certified A16 & N2P Tools

Kioxia’s Portable SSD Wins Red Dot Award for Product Design 2025

Next-Gen SoC Prototyping Gets a Lift from S2C-Andes Tie-Up

Okika Acquires Anadigm, Eyes Analog IC Breakthrough

Subscribe for Newsletters

Search

Close

Subscribe for Newsletters

Search

Close

Home
News
Stand Point
Technology
Business
Market
Startups
Videos
Magazine
PR
Products
Data Center
More
- Case Studies and Whitepapers
- Blog

Menu

Home
News
Stand Point
Technology
Business
Market
Startups
Videos
Magazine
PR
Products
Data Center
More
- Case Studies and Whitepapers
- Blog

Home
News
Stand Point
Technology
Business
Market
Startups
Videos
Magazine
PR
Products
Data Center
More
- Case Studies and Whitepapers
- Blog

Menu

Home
News
Stand Point
Technology
Business
Market
Startups
Videos
Magazine
PR
Products
Data Center
More
- Case Studies and Whitepapers
- Blog

Home » UFS 4.0

Tag:

UFS 4.0

News Product Launch Semiconductors Technology
Micron’s Tiny UFS 4.0: Power Packed, Compact Storage

by EC Editor February 28, 2024

by EC Editor February 28, 2024

Micron Technology introduces compact 9×13 mm UFS 4.0 mobile solution, featuring breakthrough firmware, 232-layer 3D NAND, and up to 1TB capacity. …

0 Facebook Twitter Pinterest Linkedin Whatsapp Telegram Email

Recent Posts

Siemens Expands TSMC Collaboration with Certified Tools for Next-Gen Chip Innovation
April 28, 2025
OKI Breaks New Ground with 124-Layer PCB for AI Semiconductor Testing
April 28, 2025
Apple to Strip Secret Robotics Unit From AI Chief Weeks After Moving Siri
April 25, 2025
ChEmpower Powers Up with $18.7M for Scratch-Free Chipmaking
April 25, 2025
George Holmes Named CEO as UBILITE Strengthens Executive Bench
April 25, 2025

Editor’s Picks

Siemens Expands TSMC Collaboration with Certified Tools for Next-Gen Chip Innovation
April 28, 2025
Apple to Strip Secret Robotics Unit From AI Chief Weeks After Moving Siri
April 25, 2025
George Holmes Named CEO as UBILITE Strengthens Executive Bench
April 25, 2025
NTT DATA, Neysa Ink MoU with Telangana Govt to Set Up Rs 10,500 Cr AI Data Centre Cluster
April 24, 2025
Kioxia’s Portable SSD Wins Red Dot Award for Product Design 2025
April 24, 2025
Next-Gen SoC Prototyping Gets a Lift from S2C-Andes Tie-Up
April 23, 2025

Electronics Clap is driven by the mission to benefit its audience from the latest electronics news, covering the business and technology aspects related to the industry.

Quick Links

Business
Case Studies & Whitepapers
Stand Point
Market
News
Latest Products
Technology

Important Links

About
Blog
Videos
Privacy Policy

Weekly Newsletter

Email

Facebook-f Twitter Youtube Linkedin

© 2022 electronicsclap.com. All rights reserved.