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soot-free

News Product Launch Semiconductors Technology
Resonac Unveils Soot-Free Bonding Film for Faster, Cleaner Semiconductor Processing

by EC Editor September 20, 2024

by EC Editor September 20, 2024

Resonac Corporation (TOKYO:4004) develops a temporary bonding film. The new film can be used for supporting a wafer on a glass carrier…

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Recent Posts

Latest US Clampdown on China’s Chips Hits Semiconductor Toolmakers
December 3, 2024
Intel in Search of New CEO as Pat Gelsinger Retires
December 3, 2024
Laser Photonics’ New R&D Initiative Aims to Accelerate Innovation
December 2, 2024
German Government Plans Billions of Euros In New Chip Subsidies: Report
December 2, 2024
Peak Technology Powers Up its Muscles with Type A Machines Acquisition
November 28, 2024

Editor’s Picks

Latest US Clampdown on China’s Chips Hits Semiconductor Toolmakers
December 3, 2024
Intel in Search of New CEO as Pat Gelsinger Retires
December 3, 2024
German Government Plans Billions of Euros In New Chip Subsidies: Report
December 2, 2024
Peak Technology Powers Up its Muscles with Type A Machines Acquisition
November 28, 2024
Lattice Semiconductor Considers Offer For Intel’s Altera Unit
November 26, 2024
Semiconductor Manufacturing firm Wolfspeed Brings Melissa Garrett as SVP & General Counsel
November 26, 2024

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