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semiconductor processing

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Resonac Unveils Soot-Free Bonding Film for Faster, Cleaner Semiconductor Processing

by EC Editor September 20, 2024

by EC Editor September 20, 2024

Resonac Corporation (TOKYO:4004) develops a temporary bonding film. The new film can be used for supporting a wafer on a glass carrier…

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Recent Posts

STMicro Partners with Hua Hong as Chipmakers Need China, says CEO
November 22, 2024
CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging
November 22, 2024
EPIGAP OSA Unwraps High-Power Shortwave Infrared LEDs
November 22, 2024
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November 21, 2024
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November 21, 2024

Editor’s Picks

STMicro Partners with Hua Hong as Chipmakers Need China, says CEO
November 22, 2024
CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging
November 22, 2024
Robotics Startup Sanctuary AI Cuts Jobs After Two Co-Founders Leave
November 21, 2024
US Finalizes $6.6 Billion Chips Award for TSMC Ahead of Trump Return
November 19, 2024
Assam’s Semiconductor Plant: A Game-Changer for India’s Semiconductor Ecosystem
November 18, 2024
Biden-Harris Administration Announces Preliminary Terms with Akash Systems to Support Development and Production of Emerging Semiconductor Technology
November 15, 2024

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