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Resonac Unveils Soot-Free Bonding Film for Faster, Cleaner Semiconductor Processing

by EC Editor September 20, 2024

by EC Editor September 20, 2024

Resonac Corporation (TOKYO:4004) develops a temporary bonding film. The new film can be used for supporting a wafer on a glass carrier…

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Recent Posts

Robotics Startup Sanctuary AI Cuts Jobs After Two Co-Founders Leave
November 21, 2024
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Editor’s Picks

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November 18, 2024
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