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NEO Semiconductor Develops 3D X-AI Chip Technology, to Replace DRAM Chips Inside HBM

by EC Editor August 12, 2024

by EC Editor August 12, 2024

3D NAND flash memory and 3D DRAM developer, NEO Semiconductor completes the development of its 3D X-AI chip technology. This technology will…

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Recent Posts

Robotics Startup Sanctuary AI Cuts Jobs After Two Co-Founders Leave
November 21, 2024
Renesas Launches Complete Memory Interface Chipset for Next-Gen DDR5 MRDIMMs
November 21, 2024
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November 20, 2024
Addverb Enters Humanoid Robotics Biz, to Launch in 2025
November 20, 2024

Editor’s Picks

Robotics Startup Sanctuary AI Cuts Jobs After Two Co-Founders Leave
November 21, 2024
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November 19, 2024
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November 18, 2024
Biden-Harris Administration Announces Preliminary Terms with Akash Systems to Support Development and Production of Emerging Semiconductor Technology
November 15, 2024
Japan Unveils $65 Billion Plan to Aid Domestic Chip Industry
November 14, 2024
ZMC Absorbs American Semiconductor Silicon Solutions & Services Firm Pure Wafer
November 14, 2024

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