Alchip Technologies, Limited, the high-performance ASIC provider, has formally opened its three-dimensional integrated circuit (3DIC) design services for the latest high-performance ASICs…
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hybrid bonding
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BusinessNewsSemiconductorsTechnology
Adeia Signs Hybrid Bonding License Agreement with Hamamatsu Photonics
by EC Editorby EC EditorAdeia Inc. (NASDAQ: ADEA) has signed a new license agreement with Hamamatsu Photonoics K. K. for Adeia’s semiconductor IP portfolio covering die-to-water…