TRENDING

Advantest Forms Strategic Partnerships with FormFactor and Technoprobe

Semiconductor Industry Faces AI Surge. Innovation Rises as Supply Concerns Persist

Ex-AMD Executive William Cooper to Helm Everspin As CFO

Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon

Mike John-Williams Succeeds John Berg as Guerrilla RF’s New CFO

Honda Signs Agreement with Renesas to Develop High-Performance SoC for SDVs

Former Qualcomm North America President Juho Sarvikas Joins Inseego as CEO

NVIDIA Launches Omniverse Blueprints to Boost Industrial and Robotic Workflows

InnoPhase IoT Expands Talaria 6 Family of SoCs

Biden-Harris Administration Awards Semiconductor Research Corporation Manufacturing Consortium Corporation $285M for New CHIPS Manufacturing USA Institute for Digital Twins, Headquartered in North Carolina

Subscribe for Newsletters

Search

Close

Subscribe for Newsletters

Search

Close

Home
News
Stand Point
Technology
Business
Market
Startups
Blog
Videos
Magazine
Products
More
- Case Studies and Whitepapers

Menu

Home
News
Stand Point
Technology
Business
Market
Startups
Blog
Videos
Magazine
Products
More
- Case Studies and Whitepapers

Home
News
Stand Point
Technology
Business
Market
Startups
Blog
Videos
Magazine
Products
More
- Case Studies and Whitepapers

Menu

Home
News
Stand Point
Technology
Business
Market
Startups
Blog
Videos
Magazine
Products
More
- Case Studies and Whitepapers

Home » High-Performance SoC

Tag:

High-Performance SoC

Automotive Business Market News Semiconductors Technology
Honda Signs Agreement with Renesas to Develop High-Performance SoC for SDVs

by Electronics Clap January 8, 2025

by Electronics Clap January 8, 2025

Honda Motor Co., Ltd. (TSE: 7267) and Renesas Electronics Corporation (TSE: 6723) enters into an agreement to develop a high-performance system-on-chip (SoC)…

0 Facebook Twitter Pinterest Linkedin Whatsapp Telegram Email

Recent Posts

Advantest Forms Strategic Partnerships with FormFactor and Technoprobe
January 9, 2025
Semiconductor Industry Faces AI Surge. Innovation Rises as Supply Concerns Persist
January 9, 2025
Ex-AMD Executive William Cooper to Helm Everspin As CFO
January 9, 2025
Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon
January 8, 2025
Mike John-Williams Succeeds John Berg as Guerrilla RF’s New CFO
January 8, 2025

Editor’s Picks

Advantest Forms Strategic Partnerships with FormFactor and Technoprobe
January 9, 2025
Semiconductor Industry Faces AI Surge. Innovation Rises as Supply Concerns Persist
January 9, 2025
Ex-AMD Executive William Cooper to Helm Everspin As CFO
January 9, 2025
Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon
January 8, 2025
Mike John-Williams Succeeds John Berg as Guerrilla RF’s New CFO
January 8, 2025
Honda Signs Agreement with Renesas to Develop High-Performance SoC for SDVs
January 8, 2025

Electronics Clap is driven by the mission to benefit its audience from the latest electronics news, covering the business and technology aspects related to the industry.

Quick Links

Business
Case Studies & Whitepapers
Stand Point
Market
News
Latest Products
Technology

Important Links

About
Blog
Videos
Privacy Policy

Weekly Newsletter

Email

Facebook-f Twitter Youtube Linkedin

© 2022 electronicsclap.com. All rights reserved.