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NEO Semiconductor Develops 3D X-AI Chip Technology, to Replace DRAM Chips Inside HBM

by EC Editor August 12, 2024

by EC Editor August 12, 2024

3D NAND flash memory and 3D DRAM developer, NEO Semiconductor completes the development of its 3D X-AI chip technology. This technology will…

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Recent Posts

Microchip Adds MTCH2120 to its Portfolio of Turnkey Capacitive Touch Controllers
December 20, 2024
Bangalore-Based SmartSoC Expands India Presence with New office in HYD
December 20, 2024
Ventiva’s New Fan-less Cooling to Enable Ultra-Thin Laptop Designs
December 19, 2024
VeriSilicon Launches Next-Gen Vitality Architecture GPU UP Series
December 19, 2024
bitsensing, NXP Signs MoU to Offer High-Performance Radar Solutions Across Various Industries
December 18, 2024

Editor’s Picks

Bangalore-Based SmartSoC Expands India Presence with New office in HYD
December 20, 2024
bitsensing, NXP Signs MoU to Offer High-Performance Radar Solutions Across Various Industries
December 18, 2024
Cohu Acquires Tignis to Enhance Data Analytics and AI/ML Platform
December 17, 2024
Singapore-Based Eureka Robotics Bags Investment from Airbus Ventures
December 16, 2024
Suchi Semicon inaugurates Outsourced Semiconductor Assembly and Testing plant in Surat
December 16, 2024
At $1 Billion Valuation, Ayar Labs Bags $155 Million
December 13, 2024

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