The U.S. Commerce Department said on Tuesday it plans to award SK hynix up to $450 million in grants to help fund…
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Chip Packaging
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BusinessNewsSemiconductorsTechnology
TSMC Considering Advanced Chip Packaging Capacity in Japan, Sources Say
by EC Editorby EC EditorTaiwan’s TSMC (2330.TW), opens new tab is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a…