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NEO Semiconductor Develops 3D X-AI Chip Technology, to Replace DRAM Chips Inside HBM

by EC Editor August 12, 2024

by EC Editor August 12, 2024

3D NAND flash memory and 3D DRAM developer, NEO Semiconductor completes the development of its 3D X-AI chip technology. This technology will…

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Consumer Electronics Market News Product Launch Semiconductors Technology
Intel’s Lunar Lake Processors Set to Transform AI PCs in Q3 2024

by EC Editor May 21, 2024

by EC Editor May 21, 2024

Intel announces that its highly anticipated Lunar Lake processors will debut in Q3 2024, arriving just in time for the holiday season.…

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Recent Posts

Robotics Startup Sanctuary AI Cuts Jobs After Two Co-Founders Leave
November 21, 2024
Renesas Launches Complete Memory Interface Chipset for Next-Gen DDR5 MRDIMMs
November 21, 2024
Enfabrica Introduces Groundbreaking ACF SuperNIC for AI Data Centers
November 21, 2024
C-Hawk Technology Launches Roberto Robotic Plastic Welding Platform
November 20, 2024
Addverb Enters Humanoid Robotics Biz, to Launch in 2025
November 20, 2024

Editor’s Picks

Robotics Startup Sanctuary AI Cuts Jobs After Two Co-Founders Leave
November 21, 2024
US Finalizes $6.6 Billion Chips Award for TSMC Ahead of Trump Return
November 19, 2024
Assam’s Semiconductor Plant: A Game-Changer for India’s Semiconductor Ecosystem
November 18, 2024
Biden-Harris Administration Announces Preliminary Terms with Akash Systems to Support Development and Production of Emerging Semiconductor Technology
November 15, 2024
Japan Unveils $65 Billion Plan to Aid Domestic Chip Industry
November 14, 2024
ZMC Absorbs American Semiconductor Silicon Solutions & Services Firm Pure Wafer
November 14, 2024

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