The supplier of equipment and services to optimize semiconductor manufacturing, Cohu, Inc. (NASDAQ: COHU) enters into a definitive agreement to acquire Tignis,…
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AI. ML
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NewsProduct Launch
Rambus’ 8.4 Gpbs HBM3-Ready Memory Subsystem to Advance AI/ML Performance
by EC Editorby EC EditorThe chip and silicon IP provider, Rambus Inc. (NASDAQ: RMBS) launches Rambus HBM3-ready memory interface subsystem consisting of a fully-integrated PHY and…