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AI-capable Smartphones

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Micron’s Tiny UFS 4.0: Power Packed, Compact Storage

by EC Editor February 28, 2024

by EC Editor February 28, 2024

Micron Technology introduces compact 9×13 mm UFS 4.0 mobile solution, featuring breakthrough firmware, 232-layer 3D NAND, and up to 1TB capacity. …

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Recent Posts

Laser Photonics Expands its PCB Depaneling
January 2, 2025
Samsung Electronics to Become Largest Shareholder in South Korea’s Rainbow Robotics
January 2, 2025
Memory Technologies Licensor Weebit Nano Licenses its ReRAM technology to onsemi
January 2, 2025
Taiwan’s Science Ministry Warns Spending Cuts Could Hit Chips, AI Funding
December 31, 2024
Nvidia Closes $700 Million Run:ai Acquisition After Regulatory Hurdles
December 31, 2024

Editor’s Picks

Samsung Electronics to Become Largest Shareholder in South Korea’s Rainbow Robotics
January 2, 2025
Memory Technologies Licensor Weebit Nano Licenses its ReRAM technology to onsemi
January 2, 2025
Taiwan’s Science Ministry Warns Spending Cuts Could Hit Chips, AI Funding
December 31, 2024
Nvidia Closes $700 Million Run:ai Acquisition After Regulatory Hurdles
December 31, 2024
Littelfuse Acquires Dortmund-Based 200nm Wafer Fab from Elmos Semiconductor SE
December 31, 2024
Nvidia Supplier Ibiden Weighs Faster Expansion to Meet AI Demand, Says CEO
December 30, 2024

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