Moving ahead with their ongoing strategic partnership on 3D-IC enablement, EDA flows and IP development across multiple Intel process nodes, Intel and…
Tag:
advanced packaging
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NewsProduct LaunchSemiconductorsTechnology
Industry-First, Multi-Protocol I/O Connectivity Chiplet from Alphawave Semi for High-Performance Computer and AI Infrastructure
by EC Editorby EC EditorThe high-speed connectivity and compute silicon for technology infrastructure provider, Alphawave Semi (LSE: AWE), has successfully taped-out industry’s first off-the-shelf multi-protocol I/O…
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BusinessNewsSemiconductorsTechnology
Intel Veteran Pooya Tadayon Joins as Ayar Labs’ VP of Packaging and Test
by EC Editorby EC EditorCalifornia-based optical interconnected solutions provider, Ayar Labs appoints Intel veteran Pooya Tadayon as its Vice President of Packaging and Test. A former…
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NewsProduct LaunchSemiconductorsTechnology
ASE Introduces powerSiP to Boost AI and Data Center Power Efficiency by 50%
by EC Editorby EC EditorAn affiliate of Mack Real Estate Group (MREG), Biscuit Flats Dev LLC, has secured the development rights to over 2,300 acres of…
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BusinessNewsSemiconductorsTechnology
India Greenlights Rs 1.26 Lakh Crore Semiconductor Push
by EC Editorby EC EditorIn a crucial development, the Indian Union Cabinet has given the green light for the establishment of three semiconductor units, a move…