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News Product Launch
pmdtechnologies Brings Second Generation 3D ToF Depth-Sensing Development Kit

by EC Editor January 17, 2022

by EC Editor January 17, 2022

The fabless IC company pmdtechnologies ag launches the next generation of its 3D Time-of-Flight Development Kit, the “flexx2”. Working in partnership…

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Recent Posts

Magnachip Expands Production of 7th Generation MXT LV MOSFETs Based on Super Short Channel FET Technology
October 29, 2024
ADI & Keysight Develop GMSL Test Methodology for Improved ADAS
October 29, 2024
TSMC Suspended Shipments to a Chinese Firm After Chip Found on Huawei Processor, Sources Say
October 28, 2024
TSMC Would Continue to Create Miracles in Global Semiconductor Industry: Co-Founder Morris Chang
October 28, 2024
Semtech Expands Smart Connectivity Advanced VoLTE Coverage
October 25, 2024

Editor’s Picks

ADI & Keysight Develop GMSL Test Methodology for Improved ADAS
October 29, 2024
TSMC Suspended Shipments to a Chinese Firm After Chip Found on Huawei Processor, Sources Say
October 28, 2024
TSMC Would Continue to Create Miracles in Global Semiconductor Industry: Co-Founder Morris Chang
October 28, 2024
HRZ Han River Launches $100 Million Venture Fund to Fuel Korea Graph Tech Startups
October 25, 2024
Renesas, Intel Team to Deliver Best-in-Class Power Management Solution
October 24, 2024
BOE and Omniply Sign Agreement to Develop New Materials, Technologies for Display Manufacturing
October 23, 2024

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