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Home » 232-layer 3D NAND

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232-layer 3D NAND

News Product Launch Semiconductors Technology
Micron’s Tiny UFS 4.0: Power Packed, Compact Storage

by EC Editor February 28, 2024

by EC Editor February 28, 2024

Micron Technology introduces compact 9×13 mm UFS 4.0 mobile solution, featuring breakthrough firmware, 232-layer 3D NAND, and up to 1TB capacity. …

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Recent Posts

RIC Robotics Announces Zyrex, World’s First AI-Powered Giant Construction Robot
April 29, 2025
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Editor’s Picks

BrainChip Partners with Chelpis-Mirle to Advance Security Solutions in Robotics
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