Nordson Electronics Solutions, an electronics manufacturing technology provider, has expanded its acclaimed SELECT Synchro selective soldering equipment family with the debut of the Synchro 3. This latest addition comes as a response to the escalating demands of high-volume printed circuit board (PCB) assembly applications. Leveraging cutting-edge technology, the Synchro 3 aims to revolutionize the selective soldering process, promising enhanced efficiency and performance.
At the heart of the Synchro 3 lies its revolutionary synchronous motion technology, a patent-pending innovation that enables a significant reduction in conveyance time. This breakthrough not only boosts throughput by 20-40% for most applications but also achieves a remarkable reduction in footprint, up to 60%. Such advancements are poised to streamline the manufacturing process, allowing for smoother and more efficient PCB assembly operations.
Designed to meet diverse manufacturing needs, the Synchro 3 offers unparalleled versatility with its ability to accommodate up to three solder pots. This feature enables manufacturers to tailor their soldering processes to different alloys and nozzle configurations, ensuring optimal results across various assembly requirements. Moreover, with its capability to handle board sizes of up to 2500 x 460 mm, the Synchro 3 caters to a wide range of PCB sizes, further enhancing its applicability in the industry.
The introduction of the Synchro 3 complements Nordson’s existing lineup of selective soldering equipment, including the Synchro 5 and 5 XL models. Together, these systems provide comprehensive solutions for single-sided, double-sided through-hole, mixed-technology surface mount, and through-hole board assemblies. With the Synchro series, Nordson aims to address the evolving needs of the electronics manufacturing industry, offering cutting-edge solutions that deliver unmatched performance and reliability.
Notably, the Synchro 3 builds upon the success of its predecessor, the Synchro 5, which received the prestigious 2023 Mexico Technology Award for outstanding innovation in printed circuit assembly (PCA) and electronics packaging. This accolade underscores Nordson’s commitment to delivering excellence and pushing the boundaries of technological advancement in the field of electronics manufacturing.
