Keysight Technologies, Inc. (NYSE: KEYS) unveils Electrical Structural Tester (EST). It is a wire bond inspection solution made for semiconductor manufacturing to ensure the integrity and reliability of electronic components.
The increasing density of chips in mission-critical applications such as medial devices and automotive systems pose challenges for the semiconductor industry. As the current testing methodologies often fall short in detecting wire bond structural defects, it leads to costly latent failures. On the other hand, traditional testing approaches often rely on sampling techniques that fail to identify wire bond structural defects.
But with Keysight’s EST, the semiconductor manufacturers can address these testing challenges. EST uses cutting-edge nano Vectorless Test Enhanced Performance 9nVTEP) technology to create a capacitive structure between the wire bond and a sensor plate. Using this method the EST can identify subtle defects such as wire sag, near shorts, and stray wires to enable comprehensive assessment of wire bond integrity.
The EST delivers advanced defect detection by analyzing capacitive coupling patterns, ensuring electronic component reliability. It supports high-volume manufacturing, testing up to 20 integrated circuits simultaneously, with a throughput of 72,000 units per hour. Additionally, big data analytics integration enhances yield through methods like MaRT, DPAT, and RPAT.
Carol Leh, Vice President, Electronic Industrial Solutions Group Center of Excellence, Keysight, said, “Keysight is dedicated to pioneering innovative solutions that address the most pressing challenges in the wire bonding process. The Electrical Structural Tester empowers chip manufacturers to enhance production efficiency by rapidly identifying wire bond defects, ensuring superior quality and reliability in high-volume manufacturing.”
The Electrical Structural Tester will be showcased at the Keysight booth (K3283) at SEMICON Taiwan 2024, Taipei Nangang Exhibition Center Hall 1, September 4-6, 2024.
