Boréas Technologies has announced the CapDrive BOS1921, a breakthrough in smartphone cooling. The piezo driver offers remarkable power efficiency, activating a piezo micropump-based cooling system with 10x less power than comparable alternatives.
Simon Chaput, CEO of Boréas Technologies, highlighted the innovation’s significance for preventing malfunctions and shutdowns caused by excessive heat in smartphones, particularly in foldable devices. The CapDrive BOS1921, with its flexible cooling-film layer, addresses the architectural challenges posed by foldable phones.
Smartphone makers are increasingly adopting the piezo micropump-based cooling platform in mass-production phones, aligning with the rising demand for foldable devices. Boréas is collaborating with leading micropump and liquid cooling-film providers to offer a comprehensive solution to smartphone OEMs.
The CapDrive BOS1921, currently in mass production, exhibits 9-11x lower power consumption than other piezo drivers. Its compact size makes it an ideal choice for resource-constrained smartphones, finding applications in PC trackpads and mobile devices.
In a market driven by innovation, Boréas Technologies aims to set a new standard with the CapDrive BOS1921, enhancing the thermal efficiency of smartphones, especially in the context of the increasing popularity of foldable phones.
