California-based thermal solutions provider Ventiva launches ICE9 thermal management suite that can cool laptops that operate at up to 40W TDP (Thermal Design Power). This will enable thinner, faster and utterly silent computing devices to function without compromising traditional, fan-based cooling systems. This allows the ICE9 solution to cool the powerful CPUs required for the next generation of feature-rich, AI-enabled, high-performance laptops.
The ICE9 thermal management suite is based on Ventiva’s patented Ionic Cooling Engine (ICE) technology, which eliminates the need for mechanical fans, using intelligent software control to enable optimal performance in electronics devices—without any moving parts, noise or vibration. The ultra-compact ICE9 solution enables laptop designs with a height of less than 12 mm, rivaling the thinnest laptops on the market today. Its space-efficient form factor not only supports sleek, thin designs but also provides original equipment manufacturers (OEMs) with the flexibility to integrate additional functionalities into their products.
“Our ICE technology is transforming the electronics market, enabling a new wave of silent, intelligent heat-transferring thermal management solutions, and our latest results underscore the remarkable scalability of our ICE9 solution,” said Carl Schlachte, Chairman, President and CEO, Ventiva. “Initially demonstrated within the ‘thin and light’ category of laptops at around 15W TDP, the ICE9 device now enables laptop manufacturers to extend these benefits to higher-performance systems, paving the way for the launch of entire product families of silent computing products.”
Ventiva is working with select partners to productize the ICE9 thermal management suite for up to 40W TDP in 2027.
