At the Samsung Foundry Forum 2023 Europe, Samsung Electronics unveiled a comprehensive range of advanced automotive process solutions, spanning from cutting-edge 2-nanometer processes to 8-inch legacy processes. Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics, emphasized the company’s commitment to meeting the evolving demands of the automotive industry, particularly in the era of electric vehicles.
Samsung’s strategic focus includes pioneering advancements like the industry’s first 5-nanometer eMRAM for automotive applications, enabling high-speed data processing and superior heat resistance. The company plans to expand its eMRAM portfolio, adding 14nm by 2024, 8nm by 2026, and 5nm by 2027. Notably, the 8nm eMRAM offers a 30% density increase and 33% speed boost compared to the 14nm process.
Additionally, Samsung Electronics outlined its roadmap, aiming to achieve mass production readiness for its 2nm process by 2026. The company is also enhancing its 8-inch Bipolar-CMOS-DMOS (BCD) process portfolio, adding 90nm by 2025, expected to reduce chip area by 20% compared to the 130nm process.
Samsung further solidified its industry presence by establishing a Multi-Die Integration (MDI) Alliance, collaborating with SAFE partners and key players in memory, package substrate, and testing. This partnership aims to drive the development of 2.5D and 3D packaging solutions tailored for diverse applications, including automotive and high-performance computing.
