Resonac Corporation (TOKYO:4004) develops a temporary bonding film. The new film can be used for supporting a wafer on a glass carrier…
Category:
Product Launch
-
-
NewsProduct LaunchSemiconductorsTechnology
SiFive Brings Intelligence XM Series to Accelerate AI Workload
by EC Editorby EC EditorThe gold standard for RISC-V computing, SiFive, Inc. introduces SiFive Intelligence XM Series to help accelerate high-performance AI workloads. Intelligence SM becomes…
-
NewsProduct Launch
Keysight’e New Quantum Circuit Simulation to Expediate Quantum Circuits Development
by EC Editorby EC EditorKeysight Technologies, Inc. (NYSE: KEYS) launches Quantum Circuits Simulation (Quantum Ckt Sim). It is a circuit design environment that speeds up the…
-
NewsProduct LaunchSemiconductorsTechnology
WACKER Develops New Specialty Silane for High-Performance Microchips
by EC Editorby EC EditorWACKER is expanding its specialty portfolio for the semiconductor industry with the development of a new precursor silane for the fabrication of…
-
NewsProduct LaunchTechnologyWireless & Networking
Networking Solutions Firm Edgecore Introduces EAP112 to Integrate Wi-Fi HaLow and IoT Gateway Solution
by EC Editorby EC EditorEdgecore Networks, a provider of innovative networking solutions for enterprises, data centers, and telecommunications, launches EAP112, a device that integrates both Wi-Fi…