World’s First 3nm Chip Could Be Used For Next Apple Silicon

TSMC Considering Advanced Chip Packaging Capacity in Japan

TSMC, the manufacturer of chips, has begun pilot production of 3-nanometer chips. Mass production is expected to begin at the end of 2022. According to DigiTimes, TSMC has kicked off pilot manufacturing of chips constructed utilizing N3 (namely 3nm process technology) at its Fab 18 in Southern Taiwan. 

 

It is being expected that TSMC’s 3nm processors will power the next generation of Apple Silicon. As of now, Apple is using TSMC’s 5nm processors for the M1chips. 3nm gate-all-around (GAA) node boosts performance by 30%, lowers power consumption by 50%, and takes 35% lesser space. 

 

Recently, TSMC and Sony came together for a deal of $7billion (roughly Rs 52000 crores) to build a new fab in Japan, which was announced collectively. However, this new plant will manufacture 22nm and 28nm processes to fulfill the supply shortage of older chips which impacted the manufacturing of automobiles to smartphones worldwide. The new fab had been announced in October by TSMC CEO CC Wei, although not yet approved by TSMC’s board of directors. 

 

The board has now authorized the brand new manufacturing unit below a brand new subsidiary, Japan Advanced Semiconductor Manufacturing, Inc. (JASM).

 

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