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TSMC to Build its First-Ever Semi-Specialized Fab in Japan

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Last week, TSMC announced its plans to build a new, semi-specialized fab in Japan to meet the chip needs of the local customers. This is the most recent addition to TSMC’s chip manufacturing capability and the first-ever in Japan. The construction will begin next year while mass production in late 2024, said company executives, and could be Japan’s largest fab for logic chips.

 

The upcoming facility will focus on mature and specialty fabrication technologies used to make long lifecycle chips for automakers and consumer electronics.

 

“After conducting due diligence, we announce our intention to build a specialty technology fab in Japan, subject to our board of directors approval,” announced CC Wei, chief executive officer of TSMC, during a conference call with investors and financial analysts, reported Anandtech. “We have received a strong commitment to support this project from both our customers and the Japanese government.”

 

“We believe the expansion of our global manufacturing footprint will enable us to better serve our customers needs,” added Wei.

 

The new plant will focus on less advanced chips, and Japan’s Sony Group Corp. will take a share in the new plant, according to WSJ report.

 

Wei further said that the company hasn’t ruled out building more facilities in places in Europe.

 

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