Siemens Digital Industries Software has announced an expanded collaboration with Taiwan Semiconductor Manufacturing Company (TSMC) to accelerate innovation in semiconductor design and integration. The strengthened partnership aims to support customers in addressing the challenges posed by next-generation technologies across key sectors including AI, automotive, hyperscale, and mobile applications.
Building on a series of successful joint initiatives, Siemens has secured certification for its Calibre nmPlatform software suite—including Calibre nmDRC, nmLVS, Calibre YieldEnhancer, and PERC tools—alongside its Analog FastSPICE (AFS) and Solido solutions for TSMC’s advanced N2P and A16 manufacturing processes. The certifications ensure that mutual customers can leverage Siemens’ tools for accurate and efficient semiconductor design and verification at the most advanced nodes.
In addition, Siemens’ Calibre 3DSTACK solution has been certified for use with TSMC’s 3DFabric technologies and the emerging 3Dblox standard, supporting the industry’s shift toward silicon stacking and advanced packaging. This collaboration also continues the companies’ joint efforts on thermal analysis and multi-level abstraction modeling for complex 3D integrated circuits.
The partnership has further extended to support TSMC’s newly introduced N3C technology and initial design enablement activities for the upcoming A14 process, laying groundwork for future innovation.
Recent achievements under this collaboration include the certification of Siemens’ AFS software for TSMC’s N2P and A16 processes, enhancing capabilities in analog, mixed-signal, RF, and memory design. Siemens’ tools now support TSMC’s Reliability Aware Simulation technology, addressing IC aging and self-heating effects. Siemens’ Solido™ Design Environment is also integrated into TSMC’s custom design reference flows for N2P, reinforcing advanced verification practices.
Siemens and TSMC have collaborated through Calibre 3DSTACK and AFS technologies to support the Compact Universal Photonic Engines (COUPE) platform, combining Siemens’ EDA expertise with TSMC’s advanced manufacturing technologies.
Further expanding the collaboration, Siemens is pursuing certification for its Aprisa physical implementation software and mPower power analysis solution for the N2P process, aiming to strengthen capabilities in analog and digital design environments.
Both companies have also completed certification for seven sign-off production flows on the AWS Cloud, including tools such as Solido SPICE, Calibre nmDRC, and mPower, ensuring high accuracy and robust security standards for cloud-based semiconductor design.
Mike Ellow, CEO of Siemens EDA, emphasized the strategic importance of the partnership: “These advances not only enhance our portfolio but also empower our mutual customers to meet the challenges of tomorrow.” Lipen Yuan, Senior Director at TSMC, added, “Our collaboration with Siemens is instrumental in pushing the boundaries of what’s possible in semiconductor technology.”
