In a move aimed at advancing silicon carbide (SiC) wafer grinding technology, Revasum Inc and Asahi Diamond America, Inc have announced a strategic collaboration. Revasum Inc, a global semiconductor manufacturing equipment leader, is teaming up with Asahi Diamond America, Inc, a provider of diamond and cubic boron nitride tools.
The collaboration centers around Revasum’s 7AF-HMG Silicon Carbide Grinder, designed specifically for the challenges posed by 150mm and 200mm silicon carbide wafers. The integration of Revasum’s expertise in semiconductor grinding and Asahi Diamond America’s abrasive technology is expected to bring notable improvements to silicon carbide wafer manufacturing.
The 7AF-HMG grinder stands out for its hard material-optimized grind engine, allowing for efficient thinning and planarization of silicon carbide wafers. This collaboration is anticipated to enhance processing capabilities for bare substrates and device wafers, addressing industry demands for precision and efficiency.
Scott Jewler, CEO of Revasum Inc, commented on the collaboration, stating, “Our work with Asahi Diamond America is a testament to our commitment to innovation and excellence in semiconductor manufacturing. The 7AF-HMG Silicon Carbide Grinder is a solution that addresses the unique challenges of silicon carbide wafers, and this cooperation will improve efficiency and performance.”
Koichi “Ken” Kikuchi, President of Asahi Diamond America, Inc, added, “Asahi Diamond America is thrilled to collaborate with Revasum Inc to elevate silicon carbide wafer grinding. Our grind wheels, combined with Revasum’s tools, will empower semiconductor manufacturers to achieve precision and efficiency in silicon carbide wafer processing.”
