Onto Innovation Receives TSMC Honor for Unique Advanced Node and Packaging Technologies

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Onto Innovation Inc. (NYSE: ONTO) today announced the company has received the Novel Technology Collaboration Award from TSMC as part of their initiative recognizing the outstanding contributions of their global suppliers.

 

“We are honoured to receive this award from an industry leader like TSMC acknowledging our collaborative development to address their high-value process challenges by deploying Onto’s unique product capabilities,” said Mike Plisinski, chief executive officer of Onto Innovation. “It has been a privilege to collaborate with the talented team at TSMC to create innovative solutions that enable their product roadmap for advanced nodes and advanced packaging.”

 

“Working together, TSMC and Onto have developed unique process control solutions for advanced logic applications using our Atlas platform and next-generation advanced packaging applications using our Dragonfly platform,” added Plisinski.

 

Onto received the Novel Technology Collaboration Award from TSMC leadership during a ceremony on March 16, 2023. Onto looks forward to continuing its relationship with TSMC as they implement future roadmap strategies that leverage the unique capabilities of Onto’s optical metrology and macro inspection portfolio products.

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