President Joe Biden joins Intel, Ohio Gov. Mike DeWine and other federal, state and local officials to celebrate breaking ground in the Silicon Heartland on two of the world’s most advanced chip-making facilities. As part of Intel’s commitment to developing a skilled talent pipeline for its two new leading-edge chip fabs, Intel also announced the first phase of funding for its Ohio Semiconductor Education and Research Program. During this first phase, Intel is providing $17.7 million for eight proposals from leading institutions and collaborators in Ohio to develop semiconductor-focused education and workforce programs.
“Today marks a pivotal moment in the journey to build a more geographically balanced and resilient semiconductor supply chain. The establishment of Silicon Heartland is a testament to the power of government incentives to unlock private investment, create thousands of high-paying jobs, and benefit U.S. economic and national security. We would not be here today without the support of leaders in the administration, Congress and the state of Ohio, who share a vision to help restore the United States to its rightful place as a leader in advanced chipmaking,” said Pat Gelsinger, Intel CEO.
Semiconductors are the brains behind the technology that powers our digital age. These chips are critical to the foundations of the U.S. economy, national security and technology leadership. Investing to revitalize the U.S. chipmaking ecosystem will bring a broad range of economic benefits, while helping to restore balance, dependability and resilience to the global semiconductor supply chain.
In Ohio, Intel’s more than $20 billion planned investment in a new semiconductor manufacturing site to produce leading-edge chips is expected to generate 7,000 construction jobs and 3,000 long-term positions in manufacturing and engineering. In addition to providing capacity for Intel’s next-generation products, the company expects these new factories to support growing demand for the company’s new foundry business, Intel Foundry Services (IFS).
Intel’s investment in Ohio builds on the company’s announcement in Arizona to build two new fabs and its expansion in New Mexico to add advanced packaging capabilities. When combined with Intel’s silicon R&D capabilities, this new site in Licking County, Ohio, will expand the company’s U.S. “lab-to-fab” pipeline.
Intel also recently celebrated the grand opening of the latest expansion of its leading-edge developmental factory in Oregon, where engineers advance Moore’s Law by creating new transistor architectures, wafer processes and packaging technologies that underpin the company’s product roadmap. That investment represents the next phase of Intel’s commitment to driving U.S. leadership in semiconductor research and development.
Intel’s Ohio Semiconductor Education and Research Program will fund collaborative proposals led by the University of Cincinnati, Central State University, Columbus State Community College, Kent State University, Lorain County Community College, Ohio University and two from The Ohio State University. Altogether, these eight proposals involve more than 80 institutions of higher education across Ohio. The eight leading institutions will receive $17.7 million in funding over three years as part of Intel’s $50 million commitment to Ohio higher education institutions over the next decade.
This collaborative program will enable higher education institutions to address semiconductor manufacturing workforce shortages and technical challenges, and to innovate and develop new capabilities with an emphasis on chipmaking. Intel expects this first iteration of the program to produce nearly 9,000 graduates for the industry and provide more than 2,300 scholarships over a three-year period, fostering a diverse homegrown talent pipeline.
“The University of Cincinnati is proud to partner with Intel as part of this historic effort to power America’s digital future. Our researchers, students and graduates stand ready to bring the vision of the Silicon Heartland to life,” said President Neville G. Pinto, University of Cincinnati.
“Ohio University is proud to play a role in this incredible investment that will boost the quality of the workforce in our state and region. We are grateful to Intel for funding our proposal, which will increase access to a high-quality education and meaningful outcomes for more Ohio students and families,” quoted President Hugh Sherman, Ohio University.
