Home » Business » Cadence’s Aparna Dey, SK Hynix’s Do Chang-Ho Join Si2 Board of Directors

Cadence’s Aparna Dey, SK Hynix’s Do Chang-Ho Join Si2 Board of Directors

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Silicon Integration Initiative (Si2), a leading research and development joint venture providing standard interoperability solutions for semiconductor design tools, announces the election of its board of directors for 2021-2022. Joining the Si2 board for their first full terms are Aparna Dey, Senior Product Marketing Group Director, Cadence Design Systems, and Do Chang-Ho, Vice President, Computer Aided Engineering Division, SK Hynix.

 

Re-elected board members are:

 

  • Richard Trihy, vice president, Design Enablement, GLOBALFOUNDRIES
  • Roger Carpenter, hardware engineer, Google
  • Leon Stok, vice president, Electronic Design Automation Technologies, IBM
  • Rahul Goyal, vice president, Intel Corp., director, R&D Strategic Enablement
  • Pankaj Kukkal, vice president, EDA, Emulation and Post-Silicon Engineering, Qualcomm Technologies
  • Jung Yun Choi, corporate vice president, Electronics Design Technology, Samsung Electronics
  • Juan C. Rey, vice president of engineering, Calibre, Siemens EDA
  • David DeMaria, corporate vice president, Strategic Initiatives and Market Intelligence, Synopsys
  • Keith Green, distinguished member of the technical staff, Texas Instruments

 

The board elected prior board member, John Lee, general manager and vice-president, Ansys, as an ex-officio board member. Lee will advise the board with regards to Si2’s long-term strategy for design-in-the-cloud, as well as for artificial intelligence and machine learning-enabled design.

 

The Si2 board represents leading semiconductor manufacturers and foundries, fabless companies, and EDA software providers. Si2’s key programs include OpenAccess, a standard application programming interface and reference source code for the design database used by all major chip design software suppliers, and the Compact Model Coalition, which selects and supports industry-standard SPICE simulation models.

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