Adeia Inc. (NASDAQ: ADEA) has signed a new license agreement with Hamamatsu Photonoics K. K. for Adeia’s semiconductor IP portfolio covering die-to-water hybrid bonding.
The new license supplements Hamamatsu’s existing license to Adeia’s DBI wafer-to-wafer hybrid bonding and ZiBond wafer-to-wafer direct bonding technologies and follows from a prior development license between the parties that included a DBI Ultra die-to-wafer hybrid bonding technology transfer.
“DBI, DBI Ultra and ZiBond technologies are currently being deployed in leading edge image sensor, photonics and MEMS products, and we look forward to expanding their applicability further in our various semiconductor devices,” said Takayuki Suzuki, Division Director, Solid State Division of Hamamatsu Photonics K.K.
“Our partnership with Hamamatsu, a global leader in optical sensors and systems, allows us to further expand the applicability of our hybrid bonding solutions to a wider range of optical sensors,” said Dana Escobar, chief licensing officer and general manager, semiconductor, at Adeia. “We look forward to working together to proliferate these technologies in more diverse applications.”
The R&D and IP licensing company, Adeia has been pioneering advancements in the semiconductor industry for over 30 years. It partners with leading semiconductor companies globally to offer its portfolio of IP covering hybrid bonding, semiconductor packaging and semiconductor processing technologies.
