Sunnyvale-based Covalent Metrology installs new Thermo Scientific Helios 5 UX DualBeam Focused Ion Beam Scanning Electron Microscope. The instrument, which is one-of-its-kind tools available through an analytical service provider in the US, is available for client projects.
As the installation is done, it has enabled Covalent to provide ultra-precise focused-ion-beam (FIB) capabilities, including enhanced lamella preparation for (scanning) transmission electron microscopy (S/TEM). Companies from the semiconductor, nanotechnology, quantum computing, and microelectronics industries will benefit from this groundbreaking FIB resolution at low FIB acceleration energies. This allows samples to be prepared with an amorphous damage layer thinner than 1 nm.
The S/TEM images generated from S/TEM samples helps Covalent customers gain deep insights. To help experts visualize elemental and structural information at atomic-scale resolution, samples must be prepared for imaging with pinpoint precision. Advanced ion-beam optics incorporated into the Helios 5 UX facilitate efficient and accurate milling and nanomanipulation. Combined with the automated alignments and improved resolution on the Helios 5 UX, samples can now be manipulated and prepared for S/TEM characterization or other FIB-SEM applications with unparalleled precision and reduced damage layers.
“Covalent’s Transmission Electron Microscopy Group is thrilled to use the new Helios 5 UX instrument to deliver even more vivid TEM and S/TEM analysis to our clients,” says Jason Donald, Director of Transmission Electron Microscopy at Covalent Metrology. “The Helios 5 UX is the top-of-line DualBeam available for this important work, and it allows us to reliably and efficiently generate the high-quality lamella needed to provide clients with the best possible TEM results.”
The Helios 5 UX’s automation and processing software maximizes consistency, and speed of S/TEM sample preparation at Covalent. With these additional capabilities, Covalent experts can now create multiple S/TEM lamella with unparalleled repeatability and quality for customer’s single site imaging needs, more advanced multi-point arrays for structured S/TEM analysis, as well as repeat or routine analytical projects.
