To accelerate time-to-reliability compliance of hyper-convergent designs targeting mission-critical applications, Synopsys, Inc. (Nasdaq: SNPS) today shared that several leading semiconductor companies have adopted its new PrimeSim Reliability Analysis solution that unifies production-proven, foundry-certified reliability analysis technologies for analog, mixed-signal and full-custom designs. Integration with PrimeSim Continuum solution provides a rich set of industry-leading simulation and analysis technologies to accelerate reliability analysis across the product lifecycle. With the exhaustive reliability assessment for early life, normal life and end-of-life failures, design engineers can minimize costly late-stage engineering change orders (ECOs) and defect escapes, and improve safety, reliability and overall design performance with better silicon correlation for next-generation, domain-specific architectures targeting complex automotive, aerospace and defense, medical and 5G applications.
“A more holistic approach is needed to address the challenges with today’s hyper-converged and mission-critical IC designs, including comprehensive electrical and manufacturing reliability and thermal assessments,” said Raja Tabet, senior vice president of the Custom Design and Manufacturing Group at Synopsys. “PrimeSim Reliability Analysis solution represents a pioneering approach to safety and reliability analysis, reimagining design for high reliability. Part of the PrimeSim Continuum family of solutions, PrimeSim Reliability Analysis solution accelerates full-lifecycle reliability signoff, enabling faster time-to-results and higher designer productivity.”
Holistic, Cohesive and High-Performance Reliability Verification
The need for safety and reliability has become paramount for critical IC applications across areas such as automotive, aerospace and medical, which require low defect rates that are often measured in defective parts per billion (DPPB), higher functional safety including compliance with industry standards such as ISO 26262 and higher long-term reliability under stringent operating conditions. IC hyper-convergence adds another layer of analysis complexity due to multi-function/multi-technology design integrations on the same SoC or system-in-package (SIP).
Synopsys’ PrimeSim Reliability Analysis solution features fast conventional and machine learning- (ML-) driven technologies that deliver significant speedup for high-sigma leaf cell characterization, static circuit checks, power/signal network integrity resistance, EM and IR signoff analysis, MOS aging analysis and safety and test coverage analysis using analog fault simulation. Certified by TSMC and qualified by Samsung Foundry, Intel and GlobalFoundries (GF), PrimeSim Reliability Analysis technologies deliver high performance while maintaining high quality-of-results.
By providing cohesive reliability verification across early, normal and end-of-life scenarios, PrimeSim Reliability Analysis solution addresses the industry’s need to produce safe and trusted hyper-converged designs. It is complemented by the Synopsys Silicon Lifecycle Management Platform solutions, which provide comprehensive post-silicon reliability monitoring, analysis and mitigation.
PrimeSim Reliability Analysis technologies are part of the ISO 26262 TCL1-certified Synopsys Custom Design Platform and can be reliably used to verify functional safety for ASIL D applications. Integration with PrimeWave™ design environment, also part of the PrimeSim Continuum solution, provides a seamless reliability verification experience, enabling unified simulation management, weakness analysis, results visualization and what-if exploration. All these technologies are cloud-ready with optimization for leading public cloud platforms and containerized environments.
