The global wafer dicing saw market is expected to grow by $91.16 million during 2021-2025, reports Technavio’s latest market report. According to its research, the Semiconductor Equipment sector witnessed a mixed impact due to the widespread growth of the COVID-19 pandemic.
The wafer dicing saws saw a significant market share growth by the pureplay foundaries. It is expected to provide significant growth opportunities to market vendors.
APAC will contribute nearly 86% to this market growth during the forecast period. Taiwan, South Korea, Japan and China are the key markets for wafer dicing saws market in APAC. The region has been recording significant growth rate and is expected to offer several business opportunities to market vendors during the forecast period. The increasing number of mobile devices, smart devices, and smart cards.
Wafer Dicing Saws Market: Major Growth Drivers
The wafer dicing saws market report the following factors as major growth drivers during the forecast period:
- Growing demand for IoT
- Increase in the number of mobile devices, smart devices, and smart cards
- Increasing in the number of fabs
