Japan’s Semiconductor Industry Boosted as Kioxia and Western Digital Secure Second Subsidy for Cutting-Edge Flash Memory Production
In a significant development for the Japanese semiconductor industry, Kioxia Corporation and Western Digital Corporation’s joint venture manufacturing facilities at Yokkaichi and Kitakami plants have been approved to receive a substantial government subsidy of up to 150 billion yen. The subsidy is part of a designated program aimed at encouraging corporate investment in cutting-edge semiconductor production facilities and ensuring stable semiconductor production in Japan.
This marks the second time that Kioxia and Western Digital’s joint venture manufacturing facilities have received such support from the Japanese government. Previously, the Yokkaichi facility was granted up to 92.9 billion yen in 2022.
The subsidized funds will specifically contribute to the production of the latest generation of 3D flash memory, utilizing innovative wafer bonding technology and future-generation advanced nodes. The joint venture, with a partnership spanning over two decades, aims to enhance the development and production capabilities of cutting-edge flash memory at the Yokkaichi and Kitakami plants.
Both companies express gratitude for the Japanese government’s support. Nobuo Hayasaka, President and CEO of Kioxia, stated, “We appreciate the support of the Japanese government and will continue to produce cutting-edge flash memory, which is indispensable for technologies that underpin the expanding digital transformation of society.”
David Goeckeler, CEO of Western Digital, also expressed thanks, saying, “We thank the Japanese government for their ongoing and unwavering commitment to our joint venture flash memory manufacturing facilities in Japan and our long track record of innovations in the NAND flash industry.”
The joint venture has played a crucial role in the semiconductor industry, creating category-defining products like the 3D flash memory.
