Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a globally recognized designer, developer, and supplier of power discretes, ICs, modules, and digital power solutions, has unveiled its MRigidCSP packaging technology, aimed at bolstering battery management applications. This technological innovation, designed to reduce on-resistance while enhancing mechanical strength, debuts on the AOCR33105E, a 12V common-drain dual N-channel MOSFET, offering potential benefits for battery applications in smartphones, tablets, and ultra-thin notebooks.
In an era characterized by the widespread adoption of fast charging in portable devices, minimizing power loss in the battery management circuit has become a priority. As charging currents escalate, achieving ultra-low electrical resistance is crucial for optimal performance. However, conventional wafer-level chip scale packages (WL-CSPs) often encounter challenges related to substrate resistance, especially when employing back-to-back MOSFETs in battery management applications. While a thinner substrate can reduce overall resistance, it can also compromise the package’s mechanical strength. This decreased strength may lead to heightened stress during the PCB assembly reflow process, potentially resulting in warping, cracking in the die, and eventual failure in the application.
The new AOCR33105E incorporates the latest trench-power MOSFET technology in a common drain configuration, offering not only ultra-low on-resistance but also ESD protection. These features are intended to enhance performance and safety in battery management functions, including protection switches and mobile battery charging and discharging circuits.
Peter H. Wilson, Senior MOSFET Product Line Marketing Director at AOS, commented on the significance of this innovation, stating, “Incorporating the AOS MRigidCSP packaging technology with our new dual N-channel MOSFET combines electrical performance improvements with the benefit of high robustness. AOS designed the MRigidCSP package technology to be used with high-aspect ratio CSP die sizes, helping to alleviate one of the major causes of battery management application production problems. Our advanced CSP construction delivers a significantly strengthened battery MOSFET that won’t warp or break during the board manufacturing process, making it a higher performance and higher reliability solution.”
Technical Highlights:
- Part Number: AOCR33105E
- Dimensions: 2.08mm x 1.45mm
- VSS (V): 12
- VGS (±V): 8
- RSS(on) Max (mOhms) @4.5V: 3
- RSS(on) Max (mOhms) @3.8V: 3.4
- RSS(on) Max (mOhms) @3.1V: 4.2
Pricing and Availability:
The AOCR33105E in the MRigidCSP package is readily available in production quantities, with a lead time of 14-16 weeks. It complies with RoHS 2.0 standards and is halogen-free, offered at a price of $0.405 in 1,000-piece quantities.
