The provider of sustainable solutions, Boyd acquires Sensata’s Qinex Semiconductor Thermal Test and Control Business (NYSE: ST) and will now operate under Boyd brand. This acquisition will complement Boyd’s existing thermal business, which includes air and liquid cooled thermal management technologies.
Boyd has closed its acquisition of the business, except for in Korea, which is pending customary regulatory approval.
Boyd designs and manufactures complex thermal solutions for high-performance semiconductors used in applications such as 5G, hyperscale data center, eMobility, and artificial intelligence. With this acquisition, Boyd expands its offering to current semiconductor customers by adding advanced controls and thermal test systems essential to the production of high-end memory and logic devices.
“This acquisition is a natural fit for Boyd and adds to our portfolio of thermal solutions for leading semiconductor companies,” said Boyd CEO Doug Britt. “The advanced technologists, material scientists, and solutions from Sensata’s Thermal Test and Controls Business broaden Boyd’s presence in the rapidly growing semiconductor industry.”
Qinex was formed by combining Sensata’s semiconductor interconnected business with Wells-CTI in 2012. Prior to divestiture, Qinex operated mostly as a stand-alone business. The business specialises in the design and manufacturing of advanced thermal control systems, adapters, and sockets critical to the thermal test process for high-end logic and memory semiconductors.
“Qinex performs well for customers and has contributed nicely to the rest of Sensata over the years,” said Jeff Cote, CEO and President of Sensata Technologies. “However, it does not align with our growth strategies and will be better positioned as part of Boyd to further expand its semiconductor testing and thermal management capabilities. Additionally, by divesting Qinex we can further fund our capital deployment initiatives, including funding our growth vectors of Electrification and Insights/IoT.”
